refractory high purity Alumina Ceramic Crucible sheet plate
Reputation depends on quality, quality comes from Hard!
Alumina Ceramics:
Alumina substrate is the most commonly used substrate material in the electronics industry. It has high mechanical and thermal properties and high chemical stability compared to most other oxide ceramics. Technical manufacturing and different shapes. Slyton Alumina substrates are already available for 3D customization. At present, there are five types of ceramic heat-dissipating substrates: HTCC, LTCC, DBC, DPC, and LAM. Among them, LAM belongs to the patented technology of Slyton and the National Optoelectronic Laboratory of Huazhong University of Science and Technology. HTCC\LTCC belongs to the sintering process, and the cost will be Higher.
DBC and DPC are professional technologies that have been developed and matured in recent years in China. DBC uses high temperature heating to combine Al2O3 with Cu plate. The technical bottleneck is that it is difficult to solve the problem of micropores between Al2O3 and Cu plates. This makes the mass production energy and yield of the product more challenging. The DPC technology uses the direct copper plating technology to deposit Cu on the Al2O3 substrate. The process combines materials and thin film process technology. The most commonly used ceramic heat sink substrate in recent years. However, its material control and process technology integration capabilities are relatively high, which makes the technical threshold for entering the DPC industry and stable production relatively high. LAM technology is also known as laser rapid activation metallization technology.
properties: High hardness, high strength, wear resistance, corrosion resistance, high temperacture (1600°), good thermal diffusivity, good insulativity, low cost etc.
Data Sheet↓
Color: White/Ivory Density: 3.9g/cm3 Alumina Content: 96% 99% 99.5% Gas permeability: 0 Water Absorption: 0 MONS' Hardness: 82 Vickers Hardness (Hv50): 15.7(1600) Gpa(Kg/mm²) Flexural Strength(20°C): 330Mpa Compressive Strength(20°C): 2000Mpa Fracture Toughness (20°C): 4 MPam1/2 Thermal Conductivity(20°C): 27.5W(m.K) Thermal Expansion Coefficient: 7.6 10-6/°C Thermal Shock Resistance: 200 △T°C
Maximum use temperature 1650°C
Dielectric Strength: ＞10 KV/mm
Dielectric Constant: 9.1er
Dielectric Loss Angle(1MHz): 0.0002-0.0003
Volume Resistivity(20°C): ＞1014Ω.cm
Application industry: Machinery, electronic, chemical, petroleum etc. Specific application: Electrical ceramic substrate, plunger, sealing ring etc.
Why Choose Us? 1.12 years of professional production industrial ceramics factory 2.High quality products with low price 3.High precision parts with lowest tolerance 4.Short time for production 5.Has a group of experienced, professional and efficient R&D team 6.Has a good reputation in China and abroad. 7.MOQ is not limited, small quantity is welcome.
8.Vigorous team and good after-sales service
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FAQ
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A: We are factory.
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A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.
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A: Yes, we could offer the sample for free charge but do not pay the cost of freight.
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A: Payment<=1000USD, 100% in advance. Payment>=1000USD, 50% T/T in advance ,balance before shippment.
