polished 96% 99% Alumina Ceramic Substrate chip shim
Reputation depends on quality, quality comes from Hard!
Alumina Ceramics:
Alumina is also known as high temperature co-fired multi-layer ceramics. The manufacturing process is very similar to LTCC. The main difference is that HTCC ceramic powder is not added to glass. Therefore, HTCC must be dried and hardened at a high temperature of 1300~1600 °C. The embryo is then drilled into the via hole, and the screen printing technology fills the hole and the printed circuit. Because of the high co-firing temperature, the selection of the metal conductor material is limited, and the main material is a high melting point but conductive. Metals such as tungsten, molybdenum, manganese, etc., which are less inferior, are finally laminated and sintered. LTCC is also called low-temperature co-fired multi-layer ceramic substrate. This technology requires first adding inorganic alumina powder and about 30% to 50% of glass material to organic binder to make it into a slurry. The scraper is used to scrape the slurry into a sheet shape, and then the sheet-like slurry is formed into a thin piece of green embryo through a drying process, and then the through hole is drilled according to the design of each layer, as the signal transmission of each layer, the internal line of the LTCC The screen printing technology is used to fill and print the lines on the raw embryos. The inner and outer electrodes can be respectively made of silver, copper, gold and other metals. Finally, the layers are laminated and placed at 850~900 °C. Sintering in a sintering furnace can be completed.
properties: High hardness, high strength, wear resistance, corrosion resistance, high temperacture (1600°), good thermal diffusivity, good insulativity, low cost etc.
Data Sheet↓
Color: White/Ivory Density: 3.9g/cm3 Alumina Content: 96% 99% 99.5% Gas permeability: 0 Water Absorption: 0 MONS' Hardness: 82 Vickers Hardness (Hv50): 15.7(1600) Gpa(Kg/mm²) Flexural Strength(20°C): 330Mpa Compressive Strength(20°C): 2000Mpa Fracture Toughness (20°C): 4 MPam1/2 Thermal Conductivity(20°C): 27.5W(m.K) Thermal Expansion Coefficient: 7.6 10-6/°C Thermal Shock Resistance: 200 △T°C
Maximum use temperature 1650°C
Dielectric Strength: ＞10 KV/mm
Dielectric Constant: 9.1er
Dielectric Loss Angle(1MHz): 0.0002-0.0003
Volume Resistivity(20°C): ＞1014Ω.cm
Application industry: Machinery, electronic, chemical, petroleum etc. Specific application: Electrical ceramic substrate, plunger, sealing ring etc.
Why Choose Us? 1.12 years of professional production industrial ceramics factory 2.High quality products with low price 3.High precision parts with lowest tolerance 4.Short time for production 5.Has a group of experienced, professional and efficient R&D team 6.Has a good reputation in China and abroad. 7.MOQ is not limited, small quantity is welcome.
8.Vigorous team and good after-sales service
Products Show
FAQ
Q: Are you trading company or manufacturer ?
A: We are factory.
Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra ?
A: Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?
A: Payment<=1000USD, 100% in advance. Payment>=1000USD, 50% T/T in advance ,balance before shippment.
