high heat conductivity cooling AIN aluminum nitride sheet
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Aluninum Nitride Ceramic:
The production of aluminum nitride ceramics is often carried out in dusty venues, and there are often many dusts in the air, which constantly fall on the surface of the equipment. They can be removed with water or alkaline solution. However, adhesion of dirt requires high-pressure water or steam to clean up. On any surface, free iron will rust and cause corrosion of stainless steel. Therefore, it must be cleared. Floating powder can generally be removed with the dust. Some have strong adhesion and must be treated with embedded iron. In addition to dust, there are many sources of iron on the surface, including cleaning with ordinary carbon steel wire brushes and shot peening with sand, glass beads or other abrasives that have been used on carbon steel, low alloy steel or cast iron parts, or Grind the aforementioned non-stainless steel products near stainless steel parts and equipment. In the process of unloading or hoisting, if no protective measures are taken for the stainless steel, the steel wire rope, spreader and the iron on the work surface are easy to embed or stain the surface. Ordering requirements and inspection after production can prevent and find the existence of free iron. ASTM Standard A380 [3] specifies the rust test method for inspecting iron or steel particles on the surface of stainless steel. This test method should be used when it is required that iron must not be present. If the result is satisfactory, use clean pure water or nitric acid to wash the surface until the dark blue color disappears completely. As the standard A380 [3] pointed out, if the rust test solution cannot be completely removed, it is not recommended to use this test method on the process surface of the equipment, that is, the direct contact surface used to produce human consumer products. A relatively simple test method is to expose for 12 to 24 hours in water to check for rust spots. This test is poorly sensitive and time-consuming. These are inspection tests, not cleanup methods. If iron is found, it must be cleaned up with the chemical and electrochemical methods described later.
Using AIN ceramics for heat resistance, melt erosion and thermal shock resistance, GaAs crystal crucible, Al evaporating dish, magnetic fluid power generation device and high temperature turbine corrosion resistant parts can be fabricated, and its optical properties can be used as an infrared window. The aluminum nitride film can be made into a high frequency piezoelectric element, a very large scale integrated circuit substrate, or the like.
Aluminum nitride heat-resistant, resistant to molten metal erosion, stable to acid, but easy to be eroded in alkaline solution. The AIN fresh surface is exposed to moist air and reacts to form a very thin oxide film. By utilizing this property, it can be used as a crucible and a die-casting mold material for smelting metals such as aluminum, copper, silver, and lead. AIN ceramics have good metallization properties and can be widely used in the electronics industry as an alternative to toxic cerium oxide.
Data Sheet:
Ø (1) high thermal conductivity (about 320W / m · K), close to BeO and SiC, more than 5 times that of Al2O3;
Ø(2) The thermal expansion coefficient (4.5×10-6°C) is matched with Si (3.5-4×10-6°C) and GaAs (6×10-6°C);
Ø (3) excellent electrical properties (dielectric constant, dielectric loss, volume resistivity, dielectric strength);
Ø(4) good mechanical properties, higher flexural strength than Al2O3 and BeO ceramics, can be sintered at normal pressure;
Ø (5) good optical transmission characteristics;
Ø(6) non-toxic;
Application industry:
Aluminum nitride powder has high purity, small particle size and high activity, and is the main raw material for manufacturing high thermal conductivity Aluminum Nitride Ceramic substrate.
Aluminum nitride ceramic substrate, high thermal conductivity, low expansion coefficient, high strength, high temperature resistance, chemical corrosion resistance, high resistivity, small dielectric loss, is an ideal large-scale integrated circuit heat sink substrate and packaging materials.
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