Dongguan Haikun New Material Co., Ltd.

heat sink cooling silicon nitride ceramic substrate wafer

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Incoterm:
FOB
Min. Order:
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Port:
Shenzhen
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  • Product Description
Overview
Product Attributes

Model No.Si3N4 116

BrandHard

TypePlate

MaterialAlumina Ceramic

StyleWestern

UsageHome Decoration

FeatureChinese

ProcessingCasting

ColorWhite/Ivory

ShapeRound

AgeModern

Surface DecorationGlazed

ApplicationMachinery, Industry, Medical, Aerospace Etc.

Supply Ability & Additional Information

PackagingCustomized

TransportationOcean,Land,Air

Place of OriginGuangdong,China

Supply Ability1,000,000 pcs/Month

CertificateSGS

PortShenzhen

Payment TypeL/C,T/T,D/P,Paypal,Money Gram,Western Union

IncotermFOB

Packaging & Delivery
Selling Units:
Piece/Pieces
Package Type:
Customized

heat sink cooling Silicon Nitride ceramic substrate wafer

Reputation depends on quality,  quality comes from Hard!


Silicon Nitride Ceramic:

The anodized film is composed of two layers, and the porous thick outer layer is grown on a dense inner layer having dielectric properties, and the latter is called a barrier layer (also called an active layer). Observation by electron microscopy revealed that the longitudinal and lateral faces of the film layer almost all showed tubular holes perpendicular to the metal surface, which penetrated the outer layer of the film up to the barrier layer between the oxide film and the metal interface. The porous alumina is surrounded by dense alumina to form a honeycomb hexagonal body called a unit cell, and the entire film layer is composed of a myriad of such unit cells. The barrier layer is composed of anhydrous aluminum oxide, which is thin and dense, has a high hardness and prevents the passage of electric current. The barrier layer has a thickness of about 0.03-0.05 μm, which is 0.5% to 2.0% after the total film. The porous outer layer of the oxide film is mainly composed of amorphous alumina and a small amount of hydrated alumina, and further contains a cation of the electrolyte. When the electrolyte is sulfuric acid, the sulfate content in the film layer is normally 13%-17%. Most of the excellent properties of the oxide film are determined by the thickness and porosity of the porous outer layer, and they are all closely related to the anodizing condition. Anodizing is divided into current forms: direct current anodization, alternating current anodization, and pulse current anodization. According to the electrolyte, there are natural anodic oxidation of sulfuric acid, oxalic acid, chromic acid, mixed acid and sulfoorganic acid as the main solution. According to the film layer, there are anodization such as a common film, a hard film (thick film), a porcelain film, a bright modification layer, and a barrier layer for semiconductor action. The common anodizing methods and process conditions for aluminum and aluminum alloys are shown in Table-5. Among them, the application of direct current sulfuric acid anodization is common.
Si3N4 chip

properties:

High hardness, high strength, wear resistance, corrosion resistance, high temperature(1200°), good thermal diffusivity, good thermal shock resistance(avoid the temperature changing rapidly), good insulativity, low density. The comprehensive properties are best in most of structure ceramic.


Data Sheet↓

Color: Black Grey
Density: >3.2g/cm3
Hardness: HRA90
Vickers Hardness (Hv50): >1550 HV0.5
Modulus of Elasticity: 290Gpa
Flexural Strength: >600Mpa
Compressive Strength: 2500Mpa
Modulus of Elasticity(25°C): 65Gpa
Fracture toughness:>6.0 Mpam1/2
Maximum Use Temperature: 1200°C
Thermal Conductivity:15-20 W(m.K)
Thermal Expansion Coefficient: >3.1 10-6/°C
Thermal Shock Resistance: 500 △T°C
Special Heat Capacity: 700 KJ/kg.K
Dielectric Strength: 1 KV/mm
Dielectric Constant: er
Volume Resistivity(20°C): 1.0*10(12)Ω.cm

Application industry:

Machinery, electronic, semiconductor, chemical, petroleum, smelt.


Specific application:

Welding shaft, electronic substrate, plunger, nozzle, slide guide, diesel parts, metal molding, shaft wheels etc.


Why Choose Us?
1.12 years of professional production industrial ceramics factory
2.High quality products with low price
3.High precision parts with lowest tolerance
4.Short time for production 
5.Has a group of experienced, professional and efficient R&D team
6.Has a good reputation in China and abroad.

7.MOQ is not limited, small quantity is welcome.

8.Vigorous team and good after-sales service


Products Show

silicon nitride



Manufacturing Process


FAQ

Q: Are you trading company or manufacturer ?
A: We are factory.
 
Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock, it is according to quantity.
 
Q: Do you provide samples ? is it free or extra ?
A: Yes, we could offer the sample for free charge but do not pay the cost of freight.
Q: What is your terms of payment ?

A: Payment<=1000USD, 100% in advance. Payment>=1000USD, 50% T/T in advance ,balance before shippment.

Product Categories : Silicon Nitride Ceramics > Silicon Nitride Ceramic Disc

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